SilexCore Conductive Glue

Solder-Free Electrical Bonding — Bond It and Connect It in One Step

Some repairs can't go near a soldering iron. Heat-sensitive components, cramped assemblies, field repairs without tools — these are the situations SC-301CG was built for. SilexCore Conductive Glue is a precision silver-loaded adhesive that physically bonds two surfaces together while simultaneously creating a reliable electrical connection, all in a single application. No heat, no flux, no rework station required. Just apply, clamp, and cure.

What Makes It Different

• Bonds and Connects in One Step

  Most repairs need both a mechanical bond and an electrical connection — two separate products, two separate steps. Conductive Glue handles both simultaneously. Apply it to a pad, a broken trace, or a connector pin, press the parts together, and the cured joint is mechanically strong and electrically conductive. This is especially valuable for SMD component reattachment where the glue must both hold the component in place and carry the signal.

• No Heat Required — Safe for Sensitive Components

  Soldering exposes surrounding components to temperatures that can damage plastic housings, shift nearby SMD parts, or crack ceramic capacitors. SC-301CG cures at room temperature — no heat gun, no iron, no risk. It's the right tool for repairing modern, densely packed circuit boards where heat damage would turn a minor fix into a full board replacement.

• Precision Applicator Tip

  The bottle's fine-tip applicator gives you the control you need to target tiny PCB pads, 0402 component footprints, or thin flex cable contacts without flooding adjacent traces. This level of precision makes the difference between a clean repair and a bridged short.

• Water-Resistant After Cure

  The cured joint is water-resistant and stands up to humidity, condensation, and light moisture exposure. Suitable for automotive electronics, outdoor sensor repairs, and any environment where occasional dampness is expected. Apply a conformal coat over the repaired area for maximum long-term protection.

• Reliable, Measurable Conductivity

  SC-301CG delivers 0.1–0.8 Ω through-glue resistance measured under real clamping conditions — low enough to carry signal, power, and ground connections without introducing meaningful voltage drop in most repair scenarios. Conductivity improves with thinner, more uniform application and clean contact surfaces.

Applications

• PCB Trace Repair: Restore broken copper traces on single-sided and multi-layer boards without a soldering iron.
• SMD Component Reattachment: Re-bond lifted surface-mount resistors, capacitors, or ICs with a conductive joint that holds mechanically and electrically.
• Flex Cable & Connector Repair: Reconnect torn flex cable conductors, broken ribbon connectors, and frayed wiring harnesses.
• Solar Cell Tabbing: Bond and connect solar cell tabs without high-temperature soldering that can crack cells.
• Automotive & Field Repairs: Fix sensor connectors, wiring repairs, and other automotive electrical faults without specialized tools.
• Conductive Bonding for Prototyping: Bond conductive layers in prototypes — foil, mesh, tape — where electrical contact and mechanical adhesion are both required.

Compatible Surfaces

• FR4 PCB and copper surfaces
• Aluminium and most metals
• Glass and ceramic substrates
• Most rigid and semi-rigid plastics

Usage Guidelines

• Clean surfaces thoroughly — remove oxides, oils, and flux residue before applying
• Apply a thin, uniform layer for lowest resistance; excess glue increases resistance
• Clamp or hold parts together during cure for best mechanical bond strength
• Full cure reached at 24 hours room temperature; accelerate with gentle heat (60°C)